cystech electronics corp. spec. no. : c769ht issued date : 2014.04.29 revised date : page no. : 1/ 3 MB05ST08 thru mb10st08 cystek product specification miniature glass passivated single phase surface mount bridge rectifiers reverse voltage 50 to 1000 volts forward current 0.8 ampere MB05ST08 thru mb10st08 mbst equivalent circuit features ? plastic package has underwriters laboratory flammability classification 94v-0 ? save space on printed circuit boards ? glass passivated chip junction ? high surge overload rating: 30a peak mechanical data ? case: molded plastic body over passivated junctions ? terminals: pure tin plated, solderable per mil-std-750 method 2026 ? high temperature soldering guaranteed : 260c/10 seconds , 0.375?(9.5mm) lead length, 5lbs(2.3kg) tension ? mounting position: any. ? weight: 0.22gram, 0.078 oz. maximum ratings and electrical characteristics ( rating at 25 c ambient temperature unless otherwise specified.) type parameter symbol mb05s t08 mb1s t08 mb2s t08 mb4s t08 mb6s t08 mb8s t08 mb10s t08 units repetitive peak reverse voltage v rrm 50 100 200 400 600 800 1000 v maximum rms voltage v rms 35 70 140 280 420 560 700 v maximum dc blocking voltage v dc 50 100 200 400 600 800 1000 v maximum instantaneous forward voltage drop per leg at 0.4a v f 1 v maximum average forward output rectified current @ta=40 c i f(av) 0.8 a peak forward surge current @8.3ms single half sine wave superimposed on rated load (jedec method) i fsm 30 a t a =25 c maximum dc reverse current at rated dc blocking voltage per leg t a =100 c i r 5 500 a typical thermal resistance per leg r ja r jl r jc 75 20 24 c /w typical diode junction capacitance @f=1mhz and applied 4v reverse voltage c j 25 pf operating junction and storage temperature range t j ;tstg -55 ~ +150 c
cystech electronics corp. spec. no. : c769ht issued date : 2014.04.29 revised date : page no. : 2/ 3 MB05ST08 thru mb10st08 cystek product specification ordering information device package shipping mbxxst08-0-t8-x mbst (pb-free lead plating and halogen-free package) 750 pcs / tape & reel characteristic curves environment friendly grade : s for rohs compliant products, g for rohs compliant and green compound products packing spec, t8 : 750 pcs / tape & reel, 7? reel product rank, zero for no rank products product name
cystech electronics corp. spec. no. : c769ht issued date : 2014.04.29 revised date : page no. : 3/ 3 MB05ST08 thru mb10st08 cystek product specification mbst dimension marking : inches millimeters inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.165 0.181 4.200 4.600 f - 0.008 - 0.200 b 0.023 0.031 0.600 0.800 g - 0.275 - 7.000 c 0.177 0.193 4.500 4.900 j 0.006 0.010 0.150 0.250 d 0.049 0.057 1.250 1.450 l - 0.650 - 1.650 e 0.900 0.106 2.300 2.700 q 0.024 0.028 0.600 0.700 notes : 1.controlling dimension : millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing spec ification or packing method, please cont act your local cystek sales office. material : ? lead : pure tin plated. ? mold compound : epoxy resin family, flammability solid burning class:ul94v-0. important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitab le for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance . mbst plastic surface mounted package cystek package code: ht xx date code device name type MB05ST08 mb1st08 mb2st08 mb4st08 mb6st08 mb8st08 mt10st08 marking 05st08 1st08 2st08 4st08 6st08 8st08 10st08
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